This machine inspects the external appearance of bonding-pad and resist
area for single layer BGA (P-BGA) with ultra-high image processing system
(HRS-4000) in high accuracy. This, as final level of inspection, covers
many defect items and avoids human error by eye. |
|
| Speed |
4 sec./piece (in case of 256 pin) |
| Applied Product |
Length 180 ~ 240mm
Width 40 ~ 60mm
Thickness 0.15 ~ 0.60mm |
| Inspection |
Vision size 25 x 25mm (Bonding-pad)
Resolution 6.3 m (Bonding-pad) |
| Image Processing System |
By Santex Corporation: HRS-4000x2 Units. (Standard)
Resolution : 4000 x 4000
3rd unit (for resist area) : optional |
| Size of machine |
(W) 2,000 X (D) 1,200 X (H) 1,800mm |
