With this new model you can enjoy a placement precision of 0.3 mm lead pitch QFP, BGA package and the usual 1005 chips to the 45 mm sq. QFPs. The BGA package is mounted by using a through/reflection light system. 256 gray scale processing and a high magnification camera enables the placement repeatability of 0.04 mm for IC components. Realizes the top level speed in its class with reduced IC mounting time (1.98 sec / QFP). High speed, soft stop conveyor reduces time interval from board discharge to next board placement. Automatic chuck change of four (4) types, and nozzle exchange of twelve (12) types (9-chips, 3-ICs) adapts to a greater component mix. A specialized chuck is used to mount odd-shaped components (i.e. connector plugs). Placement rates : Chips 6200 CPH, IC 1818 CPH Board Size 50 x 50(mm) ~ 410 x 510(mm) t=0.6~2.0(mm) Component Presentation 64 Tape Feeders (8mm), and a 20 Tray Random Access Tray Changer Mounting Head 3 Heads (2 Chucking Heads, 1 IC Head) Accuracy ±0.1mm, ±0.04mm Vision Tact 0.58 Sec/PC (2 Heads used at optimum condition) 1.98 Sec/QFP Chuck Change 4-station (option) Nozzle Change 7 types, 9 pcs. (Horizontal Chucking Head) 3 types, 3 pcs. (IC Head) Power AC 200V-240V± 10%(50/60Hz) 1.5kVA Air 0.5Mpa 34N l /min. clean air Dimensions W 1,843 x L 1,350 x H 1,620(mm) 1,500 kg Data Input Interactive and off-line programming